Lead frame for hollow plastic package

Details Lead frame for hollow plastic package Lead frame for hollow plastic package

1997-04-18

1999-03-16

Saadat, Mahshid

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257669, 257674, H01L 23495

Patent

active

058834249

ABSTRACT:
A lead frame for a hollow plastic package is constructed with a source lead, a pellet mounting portion provided at the central portion of the source lead and mounting a pellet, a lead gate and a drain gate symmetrically provided across the pellet mounting portion at the both sides thereof. Then, each lead is provided with substantially equilateral trapezoidal cut-off having the upper bottom and the lower bottom along the extending direction of the lead on a part of the lead, so that a lead bending portion is formed with a narrow part thereat.

REFERENCES:
patent: 3793474 (1974-02-01), Dunn et al.
patent: 3899305 (1975-08-01), Hilgers et al.
patent: 3902148 (1975-08-01), Drees et al.
patent: 3947867 (1976-03-01), Duffek et al.
patent: 4721993 (1988-01-01), Walter
patent: 4924292 (1990-05-01), Kaufman
patent: 5053852 (1991-10-01), Biswas et al.

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