Lead frame for enclosing semiconductor chips with resin

Details Lead frame for enclosing semiconductor chips with resin Lead frame for enclosing semiconductor chips with resin

1988-02-05

1989-09-05

Zimmerman, John J.

Metal working

Method of mechanical manufacture

Electrical device making

29841, 26427213, 26427217, 2643289, 425806, 425812, H01L 2330, B29C 4514

Patent

active

048625868

ABSTRACT:
A lead frame for enclosing a semiconductor chip with resin has a plurality of leads and at least one side frame member for supporting the leads. The lead frame is formed at a required location with a resin adhering portion for effectively removing resin and fins solidified in the air vent of a molding apparatus and formed between the lead frame and the dies of the apparatus.

REFERENCES:
patent: 3932685 (1976-01-01), Flowers
patent: 4132856 (1979-01-01), Hutchinson et al.
patent: 4151543 (1979-04-01), Hayakawa et al.
patent: 4504435 (1985-03-01), Orcott
patent: 4548574 (1985-10-01), Badalamenti
patent: 4592131 (1986-06-01), Deie
patent: 4741507 (1988-05-01), Baird

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