Lead frame for a semiconductor device

Stock material or miscellaneous articles – All metal or with adjacent metals – Having aperture or cut

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Details

174 52FP, 357 70, 428336, 428620, 428653, B23P 320, H01L 2348

Patent

active

040656250

ABSTRACT:
A lead frame for a semiconductor device, wherein a semiconductor chip-mounting portion, inner lead portions to be connected to the electrodes of said chip and outer lead portions connected to the inner lead portions are each formed of an iron core strip, both sides of which are clad with a layer of aluminum or alloy thereof.

REFERENCES:
patent: 2818360 (1957-12-01), Porter
patent: 3469953 (1969-09-01), St. Clair et al.
patent: 3705023 (1972-12-01), Fister
patent: 3714370 (1973-01-01), Nixen et al.

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