Lead frame for a multiplicity of terminals

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

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257672, H01L 2348, H01L 2946, H01L 2954, H01L 2962

Patent

active

054669677

ABSTRACT:
A lead frame for a multiplicity of terminals, in particular of large-scale integrated semiconductor chips, arranged in a very confined space and consisting of metallic conductors which converge from large outer spacings toward the terminals and can be connected to the terminals. The lead frame allows a high number of terminals with a low degree of spacing of the conductors to be produced. The conductors are produced in the outer region by a conventional production method and at their ends pointing toward the terminals by laser cutting of a uniformly metallic material.

REFERENCES:
patent: 3842492 (1974-10-01), Kamerbeek et al.
patent: 3906621 (1975-09-01), Epple
patent: 4403134 (1983-09-01), Klingel
patent: 4405875 (1983-09-01), Nagai
patent: 4514750 (1985-04-01), Adams
patent: 4529958 (1985-07-01), Person et al.
patent: 4711700 (1987-12-01), Casak
patent: 4733292 (1988-03-01), Jarvis
patent: 4872260 (1989-10-01), Johnson et al.
patent: 5034591 (1991-07-01), Fang
Patterson et al., "Laser Dambar And Flash Removal For Plastic Molded Surface Mount Components With Lead Spacing Under 20 Mils", Fifth IEEE/CHMT Int'l Electronic Manufacturing Technology Symposium, Oct. 10-12, 1988, pp. 18-21.

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