Lead frame for a multiplicity of terminals

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

257775, H01L 23495

Patent

active

056568541

ABSTRACT:
A lead frame for a multiplicity of terminals, in particular of large-scale integrated semiconductor chips, arranged in a very confined space and consisting of metallic conductors which converge from large outer spacings toward the terminals and can be connected to the terminals. The lead frame allows a high number of terminals with a low degree of spacing of the conductors to be produced. The conductors are produced in the outer region by a conventional production method and at their ends pointing toward the terminals by laser cutting of a uniformly metallic material.

REFERENCES:
patent: 3842492 (1974-10-01), Kamerbeek et al.
patent: 3906621 (1975-09-01), Epple
patent: 4403134 (1983-09-01), Klingel
patent: 4405875 (1983-09-01), Nagai
patent: 4514750 (1985-04-01), Adams
patent: 4529958 (1985-07-01), Person et al.
patent: 4711700 (1987-12-01), Cusack
patent: 4733292 (1988-03-01), Jarvis
patent: 4872260 (1989-10-01), Johnson et al.
patent: 5034591 (1991-07-01), Fang
patent: 5270570 (1993-12-01), Westerkamp
patent: 5466967 (1995-11-01), Westerkamp

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Lead frame for a multiplicity of terminals does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Lead frame for a multiplicity of terminals, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Lead frame for a multiplicity of terminals will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-162242

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.