Lead frame embedding fixture

Metal working – Method of mechanical manufacture – Electrical device making

Patent

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Details

29740, 29588, 33180R, 269315, 339 17CF, H01R 4300, B23P 1900

Patent

active

043864635

ABSTRACT:
An improved fixture (28) is provided for positioning components of an integrated circuit (10) during the manufacturing process. In particular, a boat (32) is provided for supporting the lead frame (18) and base (14) of an integrated circuit in a predetermined position for bonding and embedding of the lead frame to the base. A guide assembly (30) is employed with the boat (32) when positioning the lead frame and base. The lead frame is inverted and slid along a guide surface (46) into a notch (74) to abut a surface (76) of a stop pin (72). The opposite end of the lead frame abuts a second surface (80) on a stop bar (66). Diverging faces (68) on opposite sides of the guide surface center the lead frame relative to the boat and guide assembly. A base is then slid along the inside of the lead frame to abut against a second abutting surface (80) on the stop pin (72) to position the base and lead frame in a predetermined relationship. The guide assembly may then be removed and the boat with lead frame and base inserted into an oven for bonding. The lead frame and base are preferably supported at a slight angle to the horizontal between the stop bar and pin stop to ensure the predetermined relative position is maintained during bonding.

REFERENCES:
patent: 3524249 (1970-08-01), Hamada et al.
patent: 3617819 (1971-11-01), Boisvert
patent: 3781457 (1973-12-01), McKerreghan
patent: 3831131 (1974-08-01), Woodcock et al.
patent: 3832480 (1974-08-01), Bunker
patent: 4224637 (1980-09-01), Hargis
patent: 4232815 (1980-11-01), Nakano et al.

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