Lead frame device including ceramic encapsulated capacitor and I

Details Lead frame device including ceramic encapsulated capacitor and I Lead frame device including ceramic encapsulated capacitor and I

1981-12-22

1984-05-29

Edlow, Martin H.

357 51, 357 70, 357 75, 357 80, H01L 2328, H01L 2702, H01L 2348, H01L 2316

Patent

active

044518455

ABSTRACT:
The present invention is directed to an IC device of the ceramic encapsulated type wherein a power supply pulse dampening capacitor is embodied within the IC housing. The device is characterized by the utilization of a chip capacitor bonded to the floor of a recess formed within the housing, which capacitor forms a platform supporting the IC device. Leads between the capacitor and the power supply terminals of the circuit may be maintained at extremely short lengths, whereby inductances are minimized and relatively small capacitors effectively damp power supply pulses.

REFERENCES:
patent: 3500066 (1970-03-01), Pritchett
patent: 3617817 (1971-11-01), Kawakatsu et al.
patent: 3846823 (1974-11-01), Matthews et al.

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