Metal working – Barrier layer or semiconductor device making – Barrier layer device making
Patent
1991-12-30
1992-09-15
Hearn, Brian E.
Metal working
Barrier layer or semiconductor device making
Barrier layer device making
437209, 437220, 174 524, 29827, H01L 2160
Patent
active
051466627
ABSTRACT:
A lead frame cutting apparatus for various sized integrated circuit packages and method therefor is disclosed. This apparatus employs punches in conjunction with a thin L-shaped cutting plate, which is also symmetrical, allowing both sides to be used. This thin cutting plate is fabricated as one of a plurality of thin cutting plates using a relatively inexpensive single cutting process that cuts all the thin cutting plates in one cutting operation thereby saving money and time compared to the machined, thick cutting plate of the prior art. The L-shape of the cutting plate and the use of the associated punches allows integrated circuit packages of different sizes to be processed with the apparatus of the present invention using a two-pass approach. The integrated circuit package is positioned correctly on the L-shaped cutting plate, and the punches perform the cutting function on two of the four sides of the lead frame. The integrated circuit package is then rotated 180 degrees, and the remaining two sides of the lead frame are cut. In this manner several different sizes of integrated circuits can be processed with the cutting apparatus without changing the punch or cutting plate setup.
REFERENCES:
patent: 4642876 (1987-02-01), Murray et al.
patent: 4741787 (1988-05-01), Shimizu et al.
patent: 4816427 (1989-03-01), Dennis
patent: 4850103 (1989-07-01), Takemoto et al.
patent: 4852250 (1989-08-01), Andrews
patent: 4859632 (1989-08-01), Lumbard
patent: 4885837 (1989-12-01), Eshima et al.
patent: 5023751 (1991-06-01), Stampfli
patent: 5092031 (1992-03-01), Sato et al.
Hearn Brian E.
Picardat Kevin M.
Weiss Harry M.
LandOfFree
Lead frame cutting apparatus for various sized integrated circui does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Lead frame cutting apparatus for various sized integrated circui, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Lead frame cutting apparatus for various sized integrated circui will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-729028