Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate
2006-03-28
2006-03-28
Owens, Douglas W (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
Reexamination Certificate
active
07019387
ABSTRACT:
A lead-frame connector and circuit module assembly allows fabrication of a pin-connector type circuit module without a circuit board substrate and discrete connector. One or more integrated circuit dies are attached to a metal lead-frame assembly and the die interconnects are wire-bonded to interconnect points on the lead-frame assembly. Connector pins formed on an extension of the lead-frame assembly provide an electrical interface to a mating connector without requiring a separate connector mounted on a substrate. An extension of the lead-frame assembly out of the circuit interconnect plane provides a multi-row pin connector in applications where a multi-row connector is needed.
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Kaskoun Kenneth
Miks Jeffrey Alan
Miranda John
Amkor Technology Inc.
Owens Douglas W
Weiss, Moy & Harris P.C.
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