Lead-frame configuration for chips

Details Lead-frame configuration for chips Lead-frame configuration for chips

2007-07-17

2007-07-17

Ha, Nathan W. (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

Reexamination Certificate

active

10478269

ABSTRACT:
The invention relates to a lead-frame configuration with a frame base and multiplicity of lead-frames connected with the frame base, of which each lead-frame is intended to hold a chip, where each lead-frame has two connection plates of which each is intended to connect with a connection of a chip, where the two connection plates of each lead-frame delimit a bridging zone which can be bridged using a chip.

REFERENCES:
patent: 5005282 (1991-04-01), Rose
patent: 5826328 (1998-10-01), Guindon et al.
patent: 5867895 (1999-02-01), Van Beneden et al.
patent: 6072228 (2000-06-01), Hinkle et al.
patent: 6114756 (2000-09-01), Kinsman
patent: 6198044 (2001-03-01), Venambre et al.
patent: WO 00 30210 (2000-05-01), None

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