Lead frame coated with aluminum as a packaging material in integ

Details Lead frame coated with aluminum as a packaging material in integ Lead frame coated with aluminum as a packaging material in integ

1985-04-19

1986-08-12

O'Keefe, Veronica

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

428630, 428653, C22C 3808, H01I 2160

Patent

active

046055339

ABSTRACT:
The present invention relates to an improvement of a packaging material for use in integrated circuits (IC) such as IC, LSI and VLSI, and in particular to an improvement of a lead frame made of iron-nickel alloys used as a material in a low-melting-point glass-ceramic package. The invention resides in provision of a lead frame faces made of an iron-nickel alloy substrate containing nickel therein at a ratio of 42 to 49% by weight and the improvement wherein an aluminium layer of 0.2 to 10 microns thick is coated on both faces and sides of the substrate.

REFERENCES:
patent: 4065625 (1977-12-01), Iwai et al.

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