Lead frame carrying method and lead frame carrying apparatus

Details Lead frame carrying method and lead frame carrying apparatus Lead frame carrying method and lead frame carrying apparatus

1997-07-17

2000-03-07

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

438111, 438121, 438123, H01L 2144, H01L 2148, H01L 2150

Patent

active

060339306

ABSTRACT:
In a lead frame carrying method and apparatus, first and second press units are provided on sides of a pair of carrier rails. When carrying a lead frame along the carrier rails, a side edge portion of the lead frame is clamped by being pressed from a surface and a back face of the lead frame almost perpendicularly thereto by the first and second press units. In the lead frame, the clamped side edge portion is floated by a predetermined height above one of the carrier rails during carrying. Accordingly, the lead frame can surely be clamped and carried. In addition, when carrying the lead frame along the carrier rails, the lead frame is damaged with difficulty by the carrier rails.

REFERENCES:
patent: 4188438 (1980-02-01), Burns
patent: 5270260 (1993-12-01), Scheuenpflug
patent: 5300175 (1994-04-01), Gardner et al.
patent: 5473814 (1995-12-01), White
patent: 5661086 (1997-08-01), Nakashima
patent: 5661090 (1997-08-01), Otani

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