Lead-frame based vertical interconnect package

Details Lead-frame based vertical interconnect package Lead-frame based vertical interconnect package

1997-09-08

2000-05-09

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361816, 361818, 361803, 361764, 361767, 361772, 257734, 257736, 257750, 257782, 257784, 174 521, 174255, H05K 702

Patent

active

060612517

ABSTRACT:
A vertical interconnect package for electronic components and a method to manufacture same.
The invention provides a tripartite lead frame-based Vertical Interconnect Package (VIP) which provides integrated feedthrough and integrated shielding in a non-ceramic package. One frame functions as the substrate for coupling the IC device, the second lead frame and third lead frames form shielding and feedthroughs, with the third also providing a lid whereby an airtight chamber around the IC is formed. The invention provides a ground button (the shortest path to the die) divided into n sections providing additional RF and separate ground paths; lead frame connections are used for DC. A method for assembling includes batch lead frame assembly and test prior to singulation.
The VIP provides improved performance at lower manufacturing cost and provides easy interfaces to the printed circuit board in surface mount technology manufacturing and is compatible with die mount technologies such as flip-chip.

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