Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate
2011-08-23
2011-08-23
Brewster, William M (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
C257SE23031, C257SE21509, C257SE21502, C257SE21510, C438S123000, C438S124000, C438S111000, C438S114000
Reexamination Certificate
active
08004069
ABSTRACT:
A method of manufacturing a semiconductor package, where the package includes a surface for attachment of the package to a device by a joint formed of a connective material in a joint area of the surface. The method is characterised in that it comprises the step of patterning one or more channels on the surface which channels extend away from the joint area towards an edge of the surface. Also the method has the step of applying a compound to one or more channels which compound interacts with the connective material, such that when the semiconductor package is attached to the device the interaction defines one or more paths in the connective material. These correspond to the one or more channels on the surface and allow the passage of waste material away from the joint area to the outer edge of the surface.
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Bauer Robert
Kolbeck Anton
Baptiste Wilner Jean
Brewster William M
Freescale Semiconductor Inc.
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