Lead frame attachment for optoelectronic device

Details Lead frame attachment for optoelectronic device Lead frame attachment for optoelectronic device

1998-09-23

2000-12-19

Bowers, Charles

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Packaging or treatment of packaged semiconductor

438 31, 257 98, 257728, H01L 2100, H01L 3300, H01L 2334

Patent

active

061626538

ABSTRACT:
An optoelectronic device is mounted on a planar substrate in electrical connection with solder bumps adjacent an edge of the substrate and connection to a lead frame is made by loading the edge of the substrate on a lead frame support with lead frame conductors in engagement with the solder bumps and applying heat to melt the solder.

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Patent Abstracts of Japan, Publication #59047774, Publication Date--Mar. 17, 1984, Title: "Photo Semiconductor Device" p. 1.
International Search Report, Application No. PCT/GB99/01970, Date--Sep. 29, 1999.
U.K. Search Report for application No. GB 9816692.9; dated Nov. 10, 1998.

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