Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1995-11-13
1996-12-24
Tolin, Gerald P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
174 522, 257675, 361813, 437211, H05K 720
Patent
active
055878830
ABSTRACT:
A lead frame package for housing an integrated circuit. A lead frame (11) having a plurality of leads (13) extending from at least three sides of the package. Lead frame (11) is formed having a first region (18), a transition region (19), and a second region (21). A distance between a heat sink (12) and the lead frame (11) may vary. The offset is chosen to compensate for a predetermined distance between the heat sink (12) and the lead frame (11) such that the lead frame (11) aligns to lead frame handling equipment. A single lead frame manufacturing setup can then be used. A slot (22) is formed in the lead frame (11) extending through the second region (21) and the transition region (19) into first area (18) providing a path for injecting an encapsulation material into a mold.
REFERENCES:
patent: 3922712 (1975-11-01), Stryker
patent: 3930114 (1975-12-01), Hodge
patent: 4158745 (1979-06-01), Keller
patent: 4480262 (1984-10-01), Butt
patent: 4807018 (1989-02-01), Cellai
patent: 4849857 (1989-07-01), Butt
patent: 4916506 (1990-04-01), Gagnon
patent: 4916518 (1990-04-01), Yoshimura
patent: 4920074 (1990-04-01), Shimizu
patent: 5028741 (1991-07-01), Sanders
patent: 5031022 (1991-07-01), Yamamoto
patent: 5041902 (1991-08-01), McShane
patent: 5049973 (1991-09-01), Satriano
patent: 5210440 (1993-05-01), Long
patent: 5338971 (1994-08-01), Casati
patent: 5378924 (1995-01-01), Liang
patent: 5420758 (1995-05-01), Liang
patent: 5438021 (1995-08-01), Tawaga
Carney Lauriann T.
Johnson Gary C.
Olson Timothy L.
Strom William M.
Bingham Michael D.
Hoshizaki Gary W.
Motorola Inc.
Tolin Gerald P.
LandOfFree
Lead frame assembly for surface mount integrated circuit power p does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Lead frame assembly for surface mount integrated circuit power p, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Lead frame assembly for surface mount integrated circuit power p will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1182839