Plastic article or earthenware shaping or treating: apparatus – Distinct means to feed – support or manipulate preform stock... – Opposed registering coacting female molds
Patent
1988-10-06
1990-04-10
Chiesa, Richard L.
Plastic article or earthenware shaping or treating: apparatus
Distinct means to feed, support or manipulate preform stock...
Opposed registering coacting female molds
174250, 174251, 174255, 249 83, 26427217, 425127, 4251291, 425190, 425258, 425544, B29C 4514
Patent
active
049156071
ABSTRACT:
A lead frame assembly is disclosed which interfaces with existing wire bonders using a single track design from the bonder through the molding process. During the molding operation, the bonded lead frame is transferred into the mold on a guide track system built into the mold chase. The mold closes and clamps the lead frame after which a compound charging system meters and injects a compound into the mold cavities. The mold is opened and the strip ejected and transferred out of the mold via internal guide tracks. A granular or pellet form of compound is used in the charging system. The lead frame assembly has side rails, between which a temporary and a permanent support structure is formed. The temporary support structure is removed from the bonded integrated circuits after the bonding process is completed, while the permanent structure is made a part of the bonded integrated circuit package. A portion of the temporary support structure has a hole through it, which allows the bonding compound to pass through the lead frame to enable encapsulation of the integrated circuit both above and below the lead frame in the bonding cavity.
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Fitzgerald Susan S.
Kelley Donald R.
Medders Jerry B.
Popken Jeffrey L.
Barndt B. Peter
Chiesa Richard L.
Comfort James T.
Sharp Melvin
Texas Instruments Incorporated
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