Lead frame assembly for a semiconductor device

Details Lead frame assembly for a semiconductor device Lead frame assembly for a semiconductor device

1996-04-03

1997-06-10

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

361813, H01L 23495

Patent

active

056379170

ABSTRACT:
A lead frame assembly for a semiconductor device includes a lead frame having a lead frame main body and a first welding region, and a die pad frame having a die pad frame main body, a die pad frame, and a second welding region for welding to the first welding region of said lead frame main body. At least one of the first and second welding regions includes a welding pad for welding to the other welding region and a support bridge connected between the welding pad and a respective frame main body, supporting the welding pad from the respective frame main body, the support bridge including an element for suppressing transmission of at least one of mechanical force, heat, and electrical current.

REFERENCES:
patent: 5389818 (1995-02-01), Inoue et al.
patent: 5394751 (1995-03-01), Ishibashi
patent: 5535509 (1996-07-01), Tomita et al.

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