Lead frame assembly for a packaged semiconductor microcircuit

Details Lead frame assembly for a packaged semiconductor microcircuit Lead frame assembly for a packaged semiconductor microcircuit

1974-02-04

1976-08-31

James, Andrew J.

357 65, 357 68, 357 80, H01L 2348, H01L 2944, H01L 2952, H01L 2960

Patent

active

039785165

ABSTRACT:
A dual-in-line plastic package for an integrated circuit is assembled with the use of a thermal stress-resistant thin-film interconnect pattern on a flexible insulator film. All electrical connections to the semiconductor chip are made simultaneously by bonding directly to the thin-film interconnect pattern. Each segment of the interconnect pattern is then connected simultaneously to a simplified external lead frame, by means of a novel soldering technique. The assembly is then ready for plastic encapsulation and final trimming. By supplying both the flexible interconnect pattern and the external lead frame in continuous coils or reels, a high degree of handling simplicity, speed and accuracy is achieved with a maximum opportunity for automation, to produce a low work content product.

REFERENCES:
patent: 3440027 (1969-04-01), Hugle
patent: 3544857 (1970-12-01), Byrne et al.
patent: 3662230 (1972-05-01), Redwantz
patent: 3748726 (1973-07-01), Wiesner
patent: 3778685 (1973-12-01), Kennedy
patent: 3778686 (1973-12-01), Galvin et al.
patent: 3781596 (1973-12-01), Galli et al.
patent: 3793714 (1974-02-01), Bylander
patent: 3868724 (1975-02-01), Perrino
patent: 3868725 (1975-02-01), Degraaff
Electronics; Film Plays Supporting Role in Automating IC Assembly; Feb. 1, 1971, pp. 43 to 48.
IBM Technical Disclosure Bulletin; Joining Integrated Circuit Chips to Substrates; by Schmeckenbeacher, vol. 14, No. 1, June 1971, pp. 94 & 95.

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