Lead frame assembly and method for wiring same

Details Lead frame assembly and method for wiring same Lead frame assembly and method for wiring same

1992-06-03

1994-03-22

Jackson, Jerome

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Wire contact, lead, or bond

257786, H01L 2348, H01L 2944, H01L 2952

Patent

active

052967441

ABSTRACT:
A lead frame assembly characterized by alternating high and low wire loops which connect the attach pads of an integrated circuit die to the conductive fingers of the lead frame. The alternating loops reduce the likelihood that adjacent loops will short out due to twists in the wires or due to connecting wire "sweep" caused by subsequent plastic encapsulation. A number of high loops can be attached before the formation of the first low loop or vice versa. Alternately, the high and low wire loops can be attached in an alternating fashion.

REFERENCES:
patent: 5091772 (1992-02-01), Kohara et al.

Affiliated with

Also associated with

Rating

Lead frame assembly and method for wiring same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Lead frame assembly and method for wiring same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Lead frame assembly and method for wiring same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-438913