Lead frame and semiconductor device using the same

Details Lead frame and semiconductor device using the same Lead frame and semiconductor device using the same

1988-12-13

1990-08-21

Hille, Rolf

357 68, 357 72, H01L 2348, H01L 2944, H01L 2952

Patent

active

049511203

ABSTRACT:
A lead frame according this invention is structured such that the width or the length of the inner leads disposed adjacent to the tab suspending leads is made greater than that of other inner leads, whereby wires can be supported completely upon bonding to the leads and, accordingly, the bonding can be carried out surely and the occurrence of short-circuit of the wires can be prevented. Semiconductor devices of high electric reliability can be provided as a result these technics.

REFERENCES:
patent: 3842492 (1974-10-01), Kamerbeek et al.
patent: 4301464 (1981-11-01), Otsuki et al.
patent: 4725692 (1988-02-01), Ishii et al.

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