Lead frame and semiconductor device using the same

Details Lead frame and semiconductor device using the same Lead frame and semiconductor device using the same

1990-05-02

1991-08-20

LaRoche, Eugene R.

357 67, 357 71, H01L 2348

Patent

active

050419013

ABSTRACT:
A lead frame having a plurality of inner leads and outer leads, said outer leads being subjected to surface treatment for improving solder wettability at an end portion and to sruface treatment for suppressing solder wettability at least at a portion neighboring to the end portion, or said outer leads being bent 4 times or more, is effective for improving thermal fatigue life and reliability when applied to a semi-conductor device.

REFERENCES:
"Thermal Fatigue Strength Estimation of Solder Joints of Surface Mount IC Packages"; Kitano et al.; p. 1709.
Applicants Prior Art Figs. 11 and 13.

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