Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead
Reexamination Certificate
2005-06-21
2005-06-21
Baumeister, B. William (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Reexamination Certificate
active
06909179
ABSTRACT:
A semiconductor device includes a substrate, a semiconductor chip mounted on one surface of the substrate, wherein the semiconductor chip has an integrated circuit and bonding pads formed on a main surface thereof. The main surface of the semiconductor chip has a quadrilateral shape with the bonding pads being disposed along four sides of the main surface. A plurality of conductors is disposed on the one surface of the substrate so as to surround the semiconductor chip along four sides thereof and a plurality of bonding wires electrically connect the bonding pads with tips of the conductors, respectively. A resin body seals the semiconductor chip, the conductors and the plurality of bonding wires. A pitch between adjacent bonding pads increases in a direction toward four corners defined by the four sides of the main surface of the semiconductor chip.
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Fujisawa Atsushi
Hirano Tsugihiko
Konno Takafumi
Nagano Souichi
Okamoto Toshiaki
Antonelli Terry Stout & Kraus LLP
Baumeister B. William
Farahani Dana
Hitachi Hokkai Semiconductor Ltd.
Renesas Technology Corp.
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