Lead frame and semiconductor device using the lead frame

Details Lead frame and semiconductor device using the lead frame Lead frame and semiconductor device using the lead frame

1998-02-24

2000-07-04

Saadat, Mahshid

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

257666, 257672, 361813, H01L 23495, H05K 502

Patent

active

06084292&

ABSTRACT:
A lead frame includes a conductive base plate having a first surface on which a semiconductor element is to be mounted and a second surface opposite to the first surface, a lead forming portion arranged on the first surface of the conductive base plate, in a concavity in the first surface through etching by masking at least the lead forming portion. The lead forming portions are coupled with one another, and are not independent. Thus, bending of the lead forming portion in a lead frame is avoided. A semiconductor device using the lead frame, and methods for manufacturing the lead frame are also disclosed.

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