Lead frame and semiconductor device having the same as well...

Details Lead frame and semiconductor device having the same as well... Lead frame and semiconductor device having the same as well...

2005-05-17

2005-05-17

Lee, Eddie (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S667000, C257S669000, C257S670000, C257S673000, C257S676000, C257S724000

Reexamination Certificate

active

06894370

ABSTRACT:
A lead frame structure includes: at least a die pad for mounting a semiconductor chip thereon; a plurality of suspension members mechanically connected with the die pad; and a plurality of supporting members. Each supporting member has a connection region mechanically connected with each of the plurality of suspension members for mechanically supporting the at least die pad via the plurality of suspension pins. The connection region of the supporting member has a penetrating opening portion which provides a mechanical flexibility to the connection region and which allows the connection region to be deformed toward the suspension member upon application of a tensile stress to the suspension member in a down-set process.

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patent: 5874773 (1999-02-01), Terada et al.
patent: 6020625 (2000-02-01), Qin et al.
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patent: 6339252 (2002-01-01), Niones et al.
patent: 5-267539 (1993-10-01), None
patent: 5-315499 (1993-11-01), None

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