Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Patent
1994-06-15
1996-03-05
Hille, Rolf
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With structure for mounting semiconductor chip to lead frame
257668, 257666, H01L 2952
Patent
active
054970300
ABSTRACT:
A lead frame includes a chip mount board, on which a semiconductor chip is to be mounted, and a lead frame body. The chip mount board is made of an electrically insulated substrate and conductive patterns are formed on said insulated substrate. The lead frame body includes a plurality of leads arranged side by side to constitute a co-planar structure and used as signal leads and as ground or power supply leads arranged at the sides of said signal lead. The signal lead has a predetermined width and predetermined distances to the adjacent ground or power supply leads, and the width and distances are determined in such a manner that the signal lead has a desired characteristic impedance. A semiconductor chip is mounted on said chip mount board, electrically connected the conductive patterns on the chip mount board and, hermetically sealed with resin.
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Hille Rolf
Shinko Electric Industries Co. Ltd.
Williams Alexander Oscar
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