Lead frame and resin-encapsulated semiconductor device

Details Lead frame and resin-encapsulated semiconductor device Lead frame and resin-encapsulated semiconductor device

2006-05-01

2010-06-01

Purvis, Sue A (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257SE23037

Reexamination Certificate

active

07728414

ABSTRACT:
A power QFN package includes signal leads, a die pad, support leads, and an adhesive for die bonding. These elements are encapsulated with a resin encapsulant. The lower parts of the signal leads are exposed from the resin encapsulant to function as external electrodes. A middle part of the die pad is formed at a higher level than a peripheral part thereof. This permits the formation of through holes in a thin part of the die pad. This enhances the degree of flexibility in the size of a semiconductor chip and the moisture resistance thereof.

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