Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate
2007-12-26
2010-11-23
Andújar, Leonardo (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With structure for mounting semiconductor chip to lead frame
C257S673000, C257SE23053, C257SE23054
Reexamination Certificate
active
07838972
ABSTRACT:
A lead frame includes a lead frame main body having a plurality of die pad portions each having a chip mounting surface on which a semiconductor chip is mounted, a plurality of lead portions provided to surround the plurality of die pad portions respectively, and a frame portion for supporting the plurality of die pad portions and the plurality of lead portions, an adhesive film pasted on a lower surface of the lead frame main body by pressing, and a first metal film provided on surfaces of the plurality of lead portions and connected electrically to the semiconductor chip respectively, wherein second metal films whose thickness is substantially equal to a thickness of the first metal film are provided to the chip mounting surface of the plurality of die pad portions respectively.
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Andújar Leonardo
Harriston William
Rankin , Hill & Clark LLP
Shinko Electric Industries Co. Ltd.
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