Lead frame and method of manufacturing the lead frame

Details Lead frame and method of manufacturing the lead frame Lead frame and method of manufacturing the lead frame

2003-08-29

2008-08-19

Wilczewski, M. (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

Reexamination Certificate

active

07413930

ABSTRACT:
A plurality of inner leads, a plurality of outer leads formed in one with each of the inner lead, a bar lead of the square ring shape arranged inside a plurality of inner leads, a corner part lead which has been arranged between the inner leads of the end portion of the inner lead groups which adjoin among four inner lead groups corresponding to each side of the bar lead, and was connected with the bar lead, and a tape member joined to the tip part of each inner lead, a bar lead, and a corner part lead are included. Since the corner part lead is formed as an object for reinforcement of a frame body between adjoining inner lead groups, the rigidity of the lead frame can be increased.

REFERENCES:
patent: 5936303 (1999-08-01), Nishi
patent: 5-291454 (1993-11-01), None
patent: 5-315531 (1993-11-01), None
patent: 7-245365 (1995-09-01), None
patent: 8-204100 (1996-08-01), None
patent: 10-22432 (1998-01-01), None
patent: 11-31778 (1999-02-01), None

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