Metal treatment – Stock – Age or precipitation hardened or strengthened
Patent
1983-12-20
1987-02-03
Andrews, Melvyn J.
Metal treatment
Stock
Age or precipitation hardened or strengthened
148412, 148413, 148414, C22D 108
Patent
active
046407235
ABSTRACT:
A lead frame consists of a copper alloy containing 0.1 to 1% by weight of chromium and 0.001 to 0.5% by weight of zirconium and having a precipitate with a grain size of 0.5 to 50 .mu.m distributed therein at a rate of 1,000 to 10,000 grains/mm.sup.2. The lead frame is manufactured by casting a copper alloy containing 0.1 to 1% by weight of chromium and 0.001 to 0.5% by weight of zirconium by continuous casting, and performing rolling, a solution treatment, a cold working, and an age-hardening. The lead frame has an excellent bonding performance with an Au wire, hardness and bending strength, and is inexpensive.
REFERENCES:
patent: 3392016 (1968-07-01), Opie et al.
patent: 4047980 (1977-09-01), Watson et al.
patent: 4049426 (1977-09-01), Watson et al.
patent: 4067750 (1978-01-01), Mravic et al.
patent: 4224066 (1980-09-01), Watson et al.
patent: 4318740 (1982-03-01), Koyama
patent: 4451430 (1984-05-01), Matidori et al.
patent: 4482611 (1984-11-01), Teshima et al.
"A New Copper Alloy with High Strength and Conductivity", Taubenblat et al., Metals Engineering Quarterly/Nov. 1972, pp. 41-44.
"Effect of Zirconium on the Tensile Strength, Hardness, and Structure of a Copper-1.2% Chromium Alloy," Pekalska, 1977, Chem. Abstracts 87:121487u.
"Precipitation Type Copper Alloys for Vacuum Apparatus", Sekiba et al., Aug. 1978, Chem. Abstracts 90:42836r.
"Copper Alloy Lead Wire", Tejima et al., Dec. 1977, Chem. Abstracts 88:157142n.
"Conductive Wire for Semiconductor Device", Jpn Kokai 80 78,412, Jun. 1980, Chem. Abstracts 93:229675s.
"Electrically Conductive Copper Alloy", Matidori et al., Feb. 1981, Chem. Abstracts 94:144022.
Kuze Takashi
Sugai Shinzo
Yamane Shigemi
Andrews Melvyn J.
Tokyo Shibaura Denki Kabushiki Kaisha
Zimmerman John J.
LandOfFree
Lead frame and method for manufacturing the same does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Lead frame and method for manufacturing the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Lead frame and method for manufacturing the same will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1090240