Lead frame and manufacturing method thereof

Details Lead frame and manufacturing method thereof Lead frame and manufacturing method thereof

1996-12-12

1998-05-26

Picardat, Kevin

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

438112, 438123, H01L 2160

Patent

active

057563772

ABSTRACT:
In a lead frame, leads are formed on a surface of protective insulation film having a device hole. Protruding electrodes (solder balls) are formed on the surface of the leads opposite the surface closer to the protective insulation film. A reinforcement plate is also formed on the rear surface of the protective insulation film.

REFERENCES:
patent: 5474957 (1995-12-01), Urushima
patent: 5578525 (1996-11-01), Mizukoshi
patent: 5602059 (1997-02-01), Horiuchi et al.

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