Lead frame and manufacturing method therefor

Details Lead frame and manufacturing method therefor Lead frame and manufacturing method therefor

1994-05-24

1995-08-01

Powell, William

Etching a substrate: processes

Forming or treating electrical conductor article

Forming or treating lead frame or beam lead

257673, 437220, 216 12, 216 37, 216 41, B44C 122, C23F 102

Patent

active

054377641

ABSTRACT:
An inner lead of a lead frame has an outer end portion extending so as to be connected with a side surface of an etching stop layer and with an upper surface of an outer lead. The outer lead is formed by etching both surfaces of a metal base, and the inner lead is formed by plating metal on the metal base with a resist layer used as a mask. The pitch of the outer lead can be made fine, and a bonding strength of the inner lead to the outer lead can be increased.

REFERENCES:
patent: 5221428 (1993-06-01), Ohsawa et al.

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