Lead frame and light emitting device package using the same

Details Lead frame and light emitting device package using the same Lead frame and light emitting device package using the same

2007-02-02

2010-12-21

Vu, David (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Incoherent light emitter structure

With reflector, opaque mask, or optical element integral...

C257S079000, C257S081000, C257SE23047, C257SE23052, C257SE23053, C257SE33062, C257SE33066, C438S122000, C438S123000

Reexamination Certificate

active

07855391

ABSTRACT:
A lead frame and a light emitting device package using the same are disclosed. More particularly, a lead frame and a light emitting device package using the lead frame which can be easily manufactured and employ a multi-chip structure. The light emitting device package includes a first frame including a heat sink, a second frame coupled to an upper side of the first frame, the second frame including at least one pair of leads and a mount formed with a hole, and a molded structure for coupling the first and second frames to each other.

REFERENCES:
patent: 6274924 (2001-08-01), Carey et al.
patent: 2004/0159850 (2004-08-01), Takenaka
patent: 2008/0023721 (2008-01-01), Lee et al.
patent: 11-163411 (1999-06-01), None
patent: 10-2005-0089522 (2005-09-01), None
patent: 10-2005-0111298 (2005-11-01), None
patent: 10-2006-0079740 (2006-07-01), None
patent: WO-2004/102685 (2004-11-01), None

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