Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate
2007-06-26
2007-06-26
Ha, Nathan W. (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With structure for mounting semiconductor chip to lead frame
Reexamination Certificate
active
10482962
ABSTRACT:
A leadframe is plated with palladium only to a surface of a metal plate on which semiconductors elements are to be mounted and a surface of the metal plate to be placed on a substrate, and is not plated with palladium to lead portions, pad portions, other portions except for the surfaces to be plated and the side surface, of the leadframe, thereby, the amount of use of palladium is reduced to minimum and a cheap leadframe can be provided.
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Hamada Youichirou
Iitani Ichi
Ha Nathan W.
Kenyon & Kenyon LLP
Sumitomo Metal & Mining Co., Ltd.
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