Lead frame and integrated circuit package using the lead frame

Details Lead frame and integrated circuit package using the lead frame Lead frame and integrated circuit package using the lead frame

1996-08-08

1998-09-22

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361820, 361772, 361773, 361783, 257666, 257667, 257672, 257676, 257688, 257690, 257692, 257701, 257707, 257711, H05K 702

Patent

active

058123814

ABSTRACT:
A lead frame includes a base member having a device hole for accommodating a semiconductor chip therein, a plurality of inner lead portions extended outward from respective sides of the device hole, outer lead portions electrically connected to the inner lead portions, respectively, an adhesion area to which the inner lead portions formed on the base member are adhered, and a plurality of dummy leads disposed on a portion of the adhesion area where a density of the inner lead portions is low.

REFERENCES:
patent: 5424577 (1995-06-01), Suzuki et al.
patent: 5468991 (1995-11-01), Lee et al.
patent: 5637914 (1997-06-01), Tanaka et al.

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