Lead frame and integrated circuit package

Details Lead frame and integrated circuit package Lead frame and integrated circuit package

1999-01-25

2000-06-13

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

438106, 438121, H01L 2144, H01L 2148, H01L 2150

Patent

active

060748982

ABSTRACT:
A lead frame includes a plurality of leads held by an insulative holding film and each formed of an inner lead portion for being bonded to a semiconductor chip and an outer lead portion, a pad portion formed at an end portion of the outer lead portion, an insulating film formed in a pattern so as to insulate the adjacent leads, a ground film formed on the pad portion and partially on the insulating film and having a wider area as compared with that of the pad portion, and a projecting electrode formed on the ground film.

REFERENCES:
patent: 5184207 (1993-02-01), Cain
patent: 5291062 (1994-03-01), Higgins et al.
patent: 5409865 (1995-04-01), Karnezos
patent: 5420460 (1995-05-01), Massingill
patent: 5477080 (1995-12-01), Ishisaka et al.
patent: 5583378 (1996-12-01), Marrs et al.
patent: 5633533 (1997-05-01), Andros et al.
patent: 5786239 (1998-07-01), Ohsawa et al.
patent: 5886399 (1999-03-01), Ohsawa et al.

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