Lead frame

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Patent

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Details

257666, H01L 2348, H01L 2944, H01L 2952, H01L 2960

Patent

active

053898184

ABSTRACT:
A lead frame includes a stage portion, at least one bar-like support portion, a plurality of lead portions; and a connection portion. A semiconductor chip having pads formed on an upper surface of the semiconductor chip is mounted on the stage portion. The bar-like support portion supports the stage portion. The plurality of lead portions are arranged to surround the stage portion and connected to the pads of the semiconductor chip mounted on the stage portion, and the stage portion is arranged at a level lower than that of an arrangement surface of the lead portions. The connection portion is formed on one side of the stage portion perpendicular to a longitudinal direction of the support portion, and the connection portion has a central portion which has an upper side portion projecting almost parallelly to a surface of the stage portion at a level higher than that of the surface of the stage portion and is connected to the support portion on the same plane.

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