Lead frame

Details Lead frame Lead frame

2005-03-15

2005-03-15

Pham, Long (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Alignment marks

C257S666000, C257S667000, C257S668000

Reexamination Certificate

active

06867507

ABSTRACT:
A section of predetermined geometry and area is provided on or in a die pad of a lead frame and taken as a mark to be used for checking the position of a semiconductor chip. If the semiconductor chip is placed outside an allowable range in the X direction, the semiconductor chip overlaps the mark, thereby changing the geometry of an observable portion (slanted portion) of the mark. By means of the change, a positional deviation of the semiconductor chip in the X direction can be ascertained. A positional deviation of the semiconductor chip in Y direction is determined, by observing whether or not an electrode is situated between extensions of sides of a certain portion of the section.

REFERENCES:
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patent: 5643835 (1997-07-01), Chia et al.
patent: 6072228 (2000-06-01), Hinkle et al.
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patent: 20020053748 (2002-05-01), Tanaka et al.
patent: 20020076853 (2002-06-01), Kramer et al.
patent: 20020185753 (2002-12-01), Werner et al.
patent: 62-163962 (1987-10-01), None
patent: 05-343469 (1993-12-01), None
patent: 06-291241 (1994-10-01), None

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