Lead forming apparatus and lead forming method

Details Lead forming apparatus and lead forming method Lead forming apparatus and lead forming method

1996-10-29

1999-09-14

Larson, Lowell A.

Wireworking

Crimping

B21F 4500

Patent

active

059506873

ABSTRACT:
Four lead bending devices (40) are so disposed as to surround the forming die (31). In each of the lead bending devices (40), a rotary lever (41) extends from a rotary strut (43) and a lever guide (42) disposed therebelow holds the rotary lever (41) to prevent deflection of the rotary lever (41). The rotary strut (43) is connected to a driving unit (44). Thus, a lead forming apparatus and a lead forming method are provided to achieve improvement in flatness of end portions of leads, reduction of generation of solder-plating residues by preventing a removal of solder-plate from surfaces of the leads, and easy change of an angle of the end portions of the leads to be formed.

REFERENCES:
patent: 4945953 (1990-08-01), Kronberg
patent: 5535789 (1996-07-01), Takahashi et al.
Patent Abstracts of Japan, vol. 14, No. 213 (E-923), May 7, 1990, JP 2-49459, Feb. 19, 1990.
Patent Abstracts of Japan, vol. 14, No. 282 (E-942), Jun. 19, 1990, JP 2-90659, Mar. 30, 1990.
Patent Abstracts of Japan, vol. 18 , No. 372 (E-1577), Jul. 13, 1994, JP 6-104360, Apr. 15, 1994.
Patent Abstracts of Japan, JP 8-037263, Feb. 6, 1996.

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