Lead format for tape automated bonding

Details Lead format for tape automated bonding Lead format for tape automated bonding

1982-04-05

1983-06-28

Rutledge, L. Dewayne

Stock material or miscellaneous articles

All metal or with adjacent metals

Intermediate article

428596, 357 69, H01L 2348

Patent

active

043905986

ABSTRACT:
A lead frame (20) for tape automated bonding includes individual leads (12) each having a stretch loop (40) to accommodate elongation of the loop as the lead is bonded to a substrate (28) after inner lead bonds have been formed to an integrated circuit (26). Such a lead frame allows temporary connection and testing of the circuit prior to final lead formation and packaging.

REFERENCES:
patent: 3422213 (1969-01-01), Webb
patent: 3809800 (1974-05-01), Fletcher
patent: 3905038 (1975-09-01), Beyerlein
patent: 3947867 (1976-03-01), Duffek
patent: 4109096 (1978-08-01), Dehaine
patent: 4331740 (1982-05-01), Burns

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