Metal working – Barrier layer or semiconductor device making
Patent
1996-01-26
1999-09-21
Graybill, David E.
Metal working
Barrier layer or semiconductor device making
2281101, 228212, 228 447, H01L 21607
Patent
active
059548428
ABSTRACT:
An apparatus for stabilizing a semiconductor die and lead fingers of a lead frame during the process of wire bonding comprising a rigid clamp having at least one bond site window extending therethrough and at least one resilient secondary clamp which extends from an edge of the bond site window to a position over and in contact with lead fingers extending over the semiconductor die. The arrangement of the secondary clamp is such that the contact force with the semiconductor die is sufficient to minimize, dampen, or prevent movement of the semiconductor die and/or lead finger bounce during the wire bonding process.
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Ball Michael B.
Fogal Rich
Graybill David E.
Micro)n Technology, Inc.
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