Lead design to facilitate post-reflow solder joint quality inspe

Details Lead design to facilitate post-reflow solder joint quality inspe Lead design to facilitate post-reflow solder joint quality inspe

1990-05-01

1991-11-05

Abrams, Neil

Metal fusion bonding

Process

With measuring, testing, indicating, inspecting, or...

29843, 2281802, H05K 334

Patent

active

050625675

ABSTRACT:
An improved lead for surface-mounted electronic components is described. The improved lead includes an opening through the portion of the lead to be placed in contact with the printed circuit board for soldering. The opening, having a diameter approximately equal to the thickness of the lead, enables the detection of correctly-soldered joints using automated inspection equipment. When the lead is correctly soldered, solder is drawn by capillary action into the opening where it forms a meniscus. By automatically detecting the curvature of the meniscus, the quality of the solder joint may be determined.

REFERENCES:
patent: 4775917 (1988-10-01), Eichhorn et al.
IBM Bulletin, vol. 29, No. 4, p. 1612, Improved Lead Structure, 9-1986.

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