Lead connecting structure for a semiconductor device

Details Lead connecting structure for a semiconductor device Lead connecting structure for a semiconductor device

1979-12-21

1982-07-20

James, Andrew J.

357 65, 357 71, 357 80, H01L 2348, H01L 2944, H01L 2952

Patent

active

043409016

ABSTRACT:
An improved brazing structure is disclosed in which at least a tip end portion to be brazed of a lead is bent and this tip end portion is bonded to a metallized layer by a brazing material substantially in perpendicular to the plane of the metallized layer.

REFERENCES:
patent: 3277232 (1966-10-01), Ragan
patent: 3405382 (1968-10-01), Wright
patent: 3584265 (1971-06-01), Nier
patent: 3681667 (1972-08-01), Kokosa
patent: 3715633 (1973-02-01), Nier
patent: 3872583 (1975-03-01), Beall et al.
patent: 3908186 (1975-09-01), Anazawa et al.
patent: 4141028 (1979-02-01), Huistrunk
patent: 4185317 (1980-01-01), Lambrecht

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