Lead conditioning system for semiconductor devices

Details Lead conditioning system for semiconductor devices Lead conditioning system for semiconductor devices

1993-12-03

1996-01-30

Larson, Lowell A.

Wireworking

Crimping

B21F 0102

Patent

active

054874165

ABSTRACT:
An apparatus and method for conditioning the leads of a semiconductor device having parallel leads formed to a predetermined configuration. The apparatus includes a device for engaging and massaging the leads to reintroduce a predetermined spacing between the leads, bringing the leads into parallelism. The apparatus also includes a device for forming the leads to a partially unbent condition having at least one clamping arm pivotal between a first position spaced from the leads and a second position compressing a portion of the leads between the clamping arm and the support. The apparatus further includes a device for reforming the leads to a predetermined configuration. The lead conditioning method includes the steps of bringing the leads into parallelism, positioning the semiconductor device on a support, forming the leads to a partially unbent condition by pivoting at least one arm toward the leads and compressing a portion of the leads between the arm and the support, and shaping the leads to a partially unbent condition.

REFERENCES:
patent: 3687172 (1972-08-01), Suverkropp
patent: 3796201 (1974-03-01), Golub
patent: 3880205 (1975-04-01), Linker et al.
patent: 4103718 (1978-08-01), Steigerwald
patent: 4481984 (1984-11-01), Linker
patent: 4727912 (1988-03-01), Gonzales
patent: 4765376 (1988-08-01), Leiwe
patent: 5113916 (1992-05-01), Linker, Jr.
patent: 5273081 (1993-12-01), Maksim

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