Lead conditioning system

Details Lead conditioning system Lead conditioning system

1997-07-01

1999-01-26

Larson, Lowell A.

Wireworking

Crimping

B21F 4500

Patent

active

058628380

ABSTRACT:
A system for conditioning the leads of a semiconductor device. The system includes a base having at least one anvil surface configured to form the leads to a predetermined shape, and at least one forming arm mounted to the base. An actuator is movable relative to the base to move the forming arm from a first position, with the forming arm spaced from the leads, to a second position, with the forming arm urging the leads against the anvil surface to form the leads to a predetermined configuration.

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