Lead conditioning apparatus and method for semiconductor devices

Details Lead conditioning apparatus and method for semiconductor devices Lead conditioning apparatus and method for semiconductor devices

1991-12-11

1993-12-28

Larson, Lowell A.

Wireworking

Crimping

140147, B21F 102

Patent

active

052730816

ABSTRACT:
An apparatus and method for conditioning the leads of a semiconductor device having parallel leads projecting in a predetermined configuration. The apparatus includes a device for engaging and massaging the leads to reintroduce a predetermined spacing between the leads, bringing the leads into parallelism. The apparatus further includes a device for forming the leads to at least partially remove any bends in the leads, and a device for reforming the leads to a predetermined configuration. The lead conditioning method includes the steps of bringing the leads into parallelism, forming the leads to a partially unbent condition, and shaping the leads in a desired lead configuration.

REFERENCES:
patent: 3687172 (1972-08-01), Suverkropp
patent: 3880205 (1975-04-01), Linker et al.
patent: 4103718 (1978-08-01), Steigerwald
patent: 4481984 (1984-11-01), Linker
patent: 4727912 (1988-03-01), Gonzalez
patent: 4765376 (1988-08-01), Leiwe
patent: 5113916 (1992-05-01), Linker, Jr.

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