Lead bonding of integrated circuit chips

Details Lead bonding of integrated circuit chips Lead bonding of integrated circuit chips

1984-03-15

1986-08-12

Shaw, Clifford C.

Electric heating

Metal heating

Wire, rod, or bar bonding

219 5621, 219 8651, 219 85F, 228179, B23K 3100

Patent

active

046058338

ABSTRACT:
A method and apparatus for bonding a plurality of metallic leads to pads of a chip where the force of a thermode, which is placed in contact with the chip is increased at a first rate to a maximum force less than required to effect the bonding over a time period required to bring the metallic leads and pads close to bonding temperature, and then increasing the uniform force at a rate greater than the first rate to a force sufficient to effect the bonding. The apparatus includes a chip holder arrangement that is mounted to automatically align to the plane of the bonding thermode to provide for uniform deformities to the bump portions of the bond.

REFERENCES:
patent: 3574923 (1971-04-01), Cushman
patent: 3670396 (1972-06-01), Lindberg
patent: 3778581 (1973-12-01), Denny
patent: 3883946 (1975-05-01), Dale
patent: 3948429 (1976-04-01), Davies et al.
patent: 4340166 (1982-07-01), Bilane et al.
patent: 4484056 (1984-11-01), Russell
The Western Electric Engineer, Jul. 1979, pp. 3-10, Part I--Thermo-Compression Bonding of Beam-Lead Chip Arrays to Interconnect Circuitry on Ceramic Substrates by John A. Boyer and John A. Burns.

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