Lead bonding method and apparatus

Details Lead bonding method and apparatus Lead bonding method and apparatus

1974-09-16

1976-01-20

Truhe, J. V.

Electric heating

Metal heating

For bonding with pressure

219 68, 219 85CA, 219 85CM, B23K 1110

Patent

active

039341089

ABSTRACT:
A segment of electrically conductive wire is extended through a collet in a capillary tool and is mechanically bonded at one extended portion to a circuit point. Thereafter, an electric current having a decreasing ramp-shaped waveform is applied to the portion of the wire between the bonded circuit point and the collet to resistively heat the wire until it ruptures and forms integral balls on the ends of the wire at the rupture.

REFERENCES:
patent: 2679570 (1954-05-01), Cisne
patent: 3431384 (1969-03-01), Cooper
patent: 3524964 (1970-08-01), Milliman
patent: 3860782 (1975-01-01), Hamby

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