Lead bonding method

Details Lead bonding method Lead bonding method

1976-10-07

1978-07-04

Smith, Al Lawrence

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

228208, 228209, 228263, B23K 120, H01L 2158

Patent

active

040984524

ABSTRACT:
A bond between a refractory metal or semiconductor and a ductile metal and a method for making the same includes forming a layer of a refractory metal wetting agent such as titanium on the refractory metal before bonding to allow wetting of the refractory metal by the ductile metal.

REFERENCES:
patent: 2568242 (1951-09-01), Matteson, Jr.
patent: 2686958 (1954-08-01), Eber et al.
patent: 2874341 (1959-02-01), Biondi et al.
patent: 2945285 (1960-07-01), Jacobs
patent: 2996401 (1961-08-01), Welch et al.
patent: 3078564 (1963-02-01), Bourdeau
patent: 3409467 (1968-11-01), Foley
patent: 3567508 (1971-03-01), Cox et al.

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