Lead assembly for semiconductive device

Metal working – Means to assemble or disassemble – Puller or pusher means – contained force multiplying operator

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228208, 29588, 29589, 29590, 357 74, 357 81, H01L 2302

Patent

active

039501426

ABSTRACT:
An improved lead assembly adapted for utilization in a semiconductor device having a glass envelope, an electrical device positioned within said envelope having at least one end surface, said lead assembly comprising a metallic seal member adapted for extending through and bonding to said glass envelope and affixing to said end surface of said electrical device along a first common interface, and a metallic lead member bonded along a second common interface to said metallic seal member, said second common interface located externally of said glass envelope. The improvement comprises providing a secondary path for heat transfer in the form of a substantially uniform copper coating along the entire first common interface between said electrical device and said seal member to thereby facilitate the removal of heat from within said semiconductive device.

REFERENCES:
patent: 2373117 (1945-04-01), Hobrock
patent: 2807074 (1957-09-01), Schroeder
patent: 3422320 (1969-01-01), Woodling

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